METHOD FOR MANUFACTURING CHIP SCALE PACKAGE HAVING SLIT

摘要

PURPOSE: A method for manufacturing a chip scale package(CSP) having a slit is provided to prevent a burnt defect between adjacent patterns by using a photosensitive resin layer in the CSP, and to prevent a defect caused by overflow of an encapsulating material by forming the slit composed of a bottom surface and a side surface which are made of a photosensitive resin layer. CONSTITUTION: A polyimide tape having a conductive pattern is prepared. The first photosensitive resin layer is applied on the upper surface of the polyimide tape. An exposure and development process and an etch process are performed regarding the first photosensitive resin layer applied on the upper surface of the polyimide tape. A hardening process is performed regarding the first photosensitive resin layer which undergoes the exposure and development process and the etch process. The second photosensitive resin layer is applied on the hardened first photosensitive resin layer. An exposure and development process and an etch process are performed regarding the second photosensitive resin layer applied on the upper surface of the first photosensitive resin layer so that a slit(165) is composed of a bottom surface made of the first photosensitive resin layer and a side surface made of the second photosensitive resin layer. A conductive material is applied.