发明名称 |
Orientation-independent thermosyphon heat spreader |
摘要 |
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peripheral condenser, both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator substantially full at all orientations while leaving a void for accumulation of vapor in the condenser. A cover plate and a parallel base plate of generally similar dimension form the evaporator and condenser. Optionally, an opening in the base plate is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate may be formed with the electronics package from a single piece of material. A boiling enhancement structure is provided in the evaporator to encourage vapor bubble nucleation. |
申请公布号 |
AU2002305127(A1) |
申请公布日期 |
2002.10.21 |
申请号 |
AU20020305127 |
申请日期 |
2002.04.03 |
申请人 |
UNIVERSITY OF MARYLAND, COLLEGE PARK |
发明人 |
SUNIL S. MURTHY;YOGENDRA JOSHI;WATARU NAKAYAMA |
分类号 |
F28D15/02;F28F13/18;H01L23/427;(IPC1-7):F28D15/02 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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