WIRING BOARD, SEMICONDUCTOR DEVICE USING IT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of surely bringing the conductive pad of a connector and the terminal of the wiring board into contact and fixing them in the case of mounting the connector on the wiring board. SOLUTION: The wiring board comprises: an insulating substrate 2; conductor wiring 3 formed on the surface of the insulating substrate 2; a first projected electrode 4 formed over an area on the insulating substrate 2 on both sides of the conductor wiring 3 crossing the longitudinal direction of the conductor wiring 3; a terminal 5 formed on the surface of the insulating substrate 2 and connected with the conductor wiring 3; and a second projected electrode 6a formed on the surface of the terminal 5. The second projected electrode 6a is provided with an opening 7a formed so as to expose the surface of the terminal 5. COPYRIGHT: (C)2008,JPO&INPIT