STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE ON PCB AND METHOD FOR MANUFACTURING THEREOF

摘要

A structure for mounting a semiconductor device on a PCB(Printed Circuit Board) and a manufacturing method thereof are provided to improve reliability of a semiconductor device by removing the gas generated in a reflow soldering process by forming a gas tunnel in a copper plate. A semiconductor device(312) is mounted on a substrate(310). The substrate is mounted in a part of a copper plate. At least one tunnel(332) connected to the outside is formed in the part of the copper plate. A soldering pattern(340) forms the alloy layer between the substrate and the copper plate in a reflow soldering process. The tunnel is formed by half or full etching the copper plate. The tunnel is filled with the solder after the reflow soldering process.