发明名称 |
MOUNTING METHOD AND MOUNTING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method and a mounting apparatus which can effectively prevent a primary and secondary oxidations of metal bonds of works. SOLUTION: The mounting method of bonding a first work has a metal bonding part to a second work comprising a cleaning step of irradiating the metal bonding part of at least the first work with energy waves or energy particles, thereby cleaning them and a heating-bonding step of heating the metal bonding part of the cleaned first work in an inert gas atmosphere or a special gas atmosphere which does not react with at least the metal bonding part. This makes the first work be bonded to a bonding part of a second work. |
申请公布号 |
JP2002064268(A) |
申请公布日期 |
2002.02.28 |
申请号 |
JP20000248655 |
申请日期 |
2000.08.18 |
申请人 |
TORAY ENG CO LTD;SUGA TADATOMO |
发明人 |
SUGA TADATOMO;YAMAUCHI AKIRA |
分类号 |
H05K3/34;B23K1/20;H01L21/00;H01L21/60 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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