发明名称 MOUNTING METHOD AND MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a mounting method and a mounting apparatus which can effectively prevent a primary and secondary oxidations of metal bonds of works. SOLUTION: The mounting method of bonding a first work has a metal bonding part to a second work comprising a cleaning step of irradiating the metal bonding part of at least the first work with energy waves or energy particles, thereby cleaning them and a heating-bonding step of heating the metal bonding part of the cleaned first work in an inert gas atmosphere or a special gas atmosphere which does not react with at least the metal bonding part. This makes the first work be bonded to a bonding part of a second work.
申请公布号 JP2002064268(A) 申请公布日期 2002.02.28
申请号 JP20000248655 申请日期 2000.08.18
申请人 TORAY ENG CO LTD;SUGA TADATOMO 发明人 SUGA TADATOMO;YAMAUCHI AKIRA
分类号 H05K3/34;B23K1/20;H01L21/00;H01L21/60 主分类号 H05K3/34
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