| 摘要 |
PURPOSE: To measure X-ray stress in a short time by preliminarily measuring and determining the inclination angle of one reference point for a reference material, and measuring the inclination angle of only one point for a material to be measured. CONSTITUTION: The X-ray beam R emitted from an X-ray source 21 generates diffracted X-rays Ra, Rb according to the degree of strain of a sample 10 to be measured, and they are detected by photodiodes 32a, 32b. The outputs of the photodiodes 32a, 32b are transmitted to a computing element 34, and the computing element 34 calculates Sin<2>Ψand 2θfrom the positions and outputs of the photodiodes 32a, 32b. TheΨangle when the internal stress of the sample 10 is 0 is determined, and a reference sample in non-distorted state is set to an optional angle followed by X-ray diffraction measurement to determine the peak value 2Ψ0 of 2θby the angle of X-ray diffraction. In the actual stress measurement, theΨ0 and 2θfor the reference sample are preliminarily plotted on the sin<2>Ψ-2θ. chart, X-ray diffraction is performed to the unknown sample to determine the peak value = 2θ1 of angle of diffraction 2θwith respect to an optionalΨ1 angle. TheΨangle is separated fromΨ0 as mush as possible, whereby the measuring precision is improved.
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