| 摘要 |
PROBLEM TO BE SOLVED: To obtain a surface treatment method for an inexpensive, reliable connection terminal for a connector in which solder wettability is satisfactory using lead and tin-free metals. SOLUTION: Regarding the surface treatment method for a connection terminal for a connector in which a soldering part is subjected to surface treatment with a three structure of nickel, palladium and gold, a palladium layer is electroplated to the surface of a nickel layer under the condition where current density satisfies 1 to 10 A/dm<SP>2</SP>, and, thereafter, a gold layer is electroplated under the condition where current density satisfies 0.05 to 0.1 A/dm<SP>2</SP>, thus the thickness of the palladium layer lies in the range of 0.007 to <0.1μm, the thickness of the gold layer lies in the range of 0.003 to <0.01μm, also, the relation of the thickness of the gold layer<the thickness of the palladium layer is satisfied, and further, the gold layer partially wraps the palladium strike surface forming the palladium layer. COPYRIGHT: (C)2007,JPO&INPIT
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