发明名称 PROCESSING METHOD AND PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a processing method capable of removing an oxide formed on a metal surface with good reproducibility, and a processing apparatus used therefor. SOLUTION: In exposure in an oxidation atmosphere, an oxide film 10 is formed on a copper film 4 on the bottom surface of a via hole 9 formed on a Low-k film 7 and an etching stopper film 6. The oxide film 10 is removed by allowing an organic material expressed by a general formula (CH<SB>2</SB>O)<SB>n</SB>(n is an integer other than 1) to contact a processing target having a gaseous metallic portion on which the oxide film is formed on the surface. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007324328(A) 申请公布日期 2007.12.13
申请号 JP20060152047 申请日期 2006.05.31
申请人 TOKYO ELECTRON LTD 发明人 MIYOSHI SHUSUKE
分类号 H01L21/768;H01L21/308;H01L21/3205;H01L23/52 主分类号 H01L21/768
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