| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for which a plurality of semiconductor devices can be stably laminated, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device includes a semiconductor chip 20, a resin part which seals the semiconductor chip 20 and has a first through-hole 17, and a through electrode 14 electrically connected with the semiconductor chip 20 and configured to pass through the resin part 22 and to communicate between the upper end and lower end of the inner surface of the first through-hole 17. A void 16 provided continuously between a surface equivalent to the upper surface of the resin part 22 and a surface equivalent to the lower surface is formed inside the first through-hole 17. <P>COPYRIGHT: (C)2009,JPO&INPIT |
