发明名称 VERTICAL HOLE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a highly sensitive vertical hole device without increasing a chip area.SOLUTION: In the vertical hole device, a trench inside of which is filled with an insulating film is provided between a voltage output terminal and a first current supply terminal. Thereby, by suppressing current flow-in to the voltage output terminal, a relative amount of a vertical current component is increased. Thus, it becomes possible to enhance the sensitivity.SELECTED DRAWING: Figure 1
申请公布号 JP2016111333(A) 申请公布日期 2016.06.20
申请号 JP20150191873 申请日期 2015.09.29
申请人 SII SEMICONDUCTOR CORP 发明人 SUZUKI SATOYUKI;EBIHARA MIKA;TOBIOKA TAKAAKI
分类号 H01L43/06;G01R33/07 主分类号 H01L43/06
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