| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device manufacturing method which can prevent a solder scattered at the time of reflow from adhering to a top face of a semiconductor element thereby to improve productivity.SOLUTION: A semiconductor device manufacturing method comprises the steps of: mounting on a base plate 3a, a positioning jig 12 which has an opening 13 and a protrusion 14 provided on an internal surface of the opening 13; placing a solder 4 on the base plate 3a in the opening 13; mounting on the solder 4a in the opening 13, a transistor element 1a which has an upper surface electrode 11a and a lower surface electrode 11c on an upper surface and a lower surface, respectively; and performing reflow in a state where the protrusion 14 is arranged on the side of the transistor element 1a to bond the lower surface electrode 11c of the transistor element 1a to the base plate 3a by the solder 4a, thereby blocking the solder 4a scattered at the time of reflow by the protrusion 14.SELECTED DRAWING: Figure 5 |
