发明名称 |
Method of replacing an existing contact of a wafer probing assembly |
摘要 |
The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer. |
申请公布号 |
US9429638(B2) |
申请公布日期 |
2016.08.30 |
申请号 |
US201313854725 |
申请日期 |
2013.04.01 |
申请人 |
Cascade Microtech, Inc. |
发明人 |
Smith Kenneth R. |
分类号 |
H01R43/20;G01R35/00;G01R1/067;B32B38/10;G01R1/073 |
主分类号 |
H01R43/20 |
代理机构 |
Dascenzo Intellectual Property Law, P.C. |
代理人 |
Dascenzo Intellectual Property Law, P.C. |
主权项 |
1. A method of replacing an existing contact of a wafer probing assembly, the method comprising:
separating an existing coupon from a support surface of the wafer probing assembly, wherein the existing coupon includes an existing elastomeric layer and an existing contact, wherein the support surface is defined by a dielectric support and a support conductor, wherein the existing coupon is detachably affixed to the support surface by an existing adhesive bond, and further wherein the separating includes breaking the existing adhesive bond; and detachably affixing a replacement coupon to the support surface of the wafer probing assembly with a replacement adhesive to form a replacement adhesive bond, wherein the replacement coupon includes a replacement elastomeric layer and a replacement contact, and further wherein the detachably affixing further includes establishing electrical communication between the replacement contact and the support conductor. |
地址 |
Beaverton OR US |