发明名称 RESIN SEALING METHOD OF SEMICONDUCTOR CHIP AND LEAD FRAME FOR RESIN SEALING TYPE SEMICONDUCTOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a resin sealing method that can form a resin mold with a predetermined shape as predetermined, and to provide a lead frame necessary for the same. SOLUTION: This lead frame 60 has grooved air vents 62 extending from the inner edge of a frame 24 to the outer edge of the frame 24, arranged near a stay 26 on both sides of the stay on both faces of the lead frame 24. Although a resin accompanied by the air run out of a cavity is adhered to the air vent of the lead frame when the lead frame 60 is taken out of a resin sealing die, it is taken out of the resin sealing die with the lead frame. Hereby, since the resin does not remain in the resin sealing die, the sequential resin sealing can be implemented without trouble by using the same resin sealing die. By the method shown in the embodiment, it is possible to form the resin mold with the predetermined shape in the predetermined position.
申请公布号 JP2002100646(A) 申请公布日期 2002.04.05
申请号 JP20000288502 申请日期 2000.09.22
申请人 SONY CORP 发明人 TOMIYAMA HIROSHI
分类号 B29C45/14;H01L21/56;H01L23/28;H01L23/50 主分类号 B29C45/14
代理机构 代理人
主权项
地址