SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to prevent the exfoliation between a molding resin and a substrate and improving the quality of the semiconductor device. CONSTITUTION: Peeling between a molding resin and a substrate is to be prevented to improve the quality of a semiconductor device. A film substrate(2) capable of being deformed following shrinkage on curing of a molding resin and having plural partitioned device areas is provided, then a block molding is performed so as to cover the plural device areas in a lump on a chip bearing surface side of the film substrate(2), and thereafter the film substrate(2) is subjected to dicing wherein a cutting blade is advanced toward a block molding portion to divide the film substrate device area by device area in accordance with a down cutting method, whereby peeling of the substrate in the dicing work can be prevented.