HIGH-DENSITY INTEGRATED CIRCUIT PACKAGE, INTEGRATED CIRCUIT SUPPORTER AND MUTUAL CONNECTION CARD FORMED BY SAID SUPPORTER

摘要

PURPOSE: To provide an effective shield between signal pads by connecting a part of a power supply pad to the outer side end edge part of each potential surface, arranging it between the signal pads, and making it a shield between the groups of the signal pads. CONSTITUTION: The power supply pads 15a and 15b are extended to the inside of TAB(Tape-Automated Bonding) lead 16 and they are connected to the end edge parts on the inner side and outer side of conductor surfaces 26a and 26b surrounding an integrated circuit 11. That is, the extended power supply pads 15a and 15b are arranged between the signal pads 15s for shielding the groups of the signal pads and long power supply conductors 15a and 15b corresponding to the upper side face of the integrated circuit 11 and separate the two groups of the signal pads adjacent to each other. Thus, the effective shield is obtained between the signal pads.