| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for plasma-cleaning an electronic component which maintain a tact time, without increasing the evacuation time due to advance of the deposition of contaminants on the inner wall of a vacuum chamber. SOLUTION: The plasma cleaning apparatus for removing contaminants on the surface of a work by generating a plasma in a vacuum chamber comprises a removable shield member on the inner wall of the vacuum chamber. When the removed contaminants deposit to the inner wall of the chamber, the quantity of water content/gas absorbed by the contaminants increases to increase the evacuation time and hence the vacuum reach time T is measured every treating cycle, thereby instructing for cleaning/removing the shield member, if T exceeds a set time T0. Thus, contaminants never deposit over a limit to suppress the evacuation time from increasing within a fixed limit enough to maintain a tact time. |
