| 摘要 |
<p>PROBLEM TO BE SOLVED: To mount a plurality of semiconductor elements on a semiconductor package to enable a multi-chip modularization to realize without making large the external size of the package by a method, wherein the semiconductor element is arranged in a recessed part opening outward of an insulating base body, and a cover body for blocking this recessed part is constituted of another semiconductor element. SOLUTION: A cavity for semiconductor element is formed in an insulating base body 15 in a state such that the upper part of the cavity is opened. That is, a deep recessed part 16 is formed in the base body 15 in two steps, and a slightly shallow recessed part 17 is formed on the outside of the recessed part 16 in two steps. A semiconductor element 23 is die-bonded, curing of the element 23 is conducted, and the element 23 is bonded to the part 16 and is fixed in the part 16. A semiconductor element 28, which also serves as a cover body, is arranged in such a way as to block the shallow recessed part 17 in the base body 15 and is made to align with connection lands 18. In this state, this semiconductor package is introduced quietly in a reflow furnace, and a heating treatment is performent on the package in a reducing atmosphere, whereby electrodes under the lower part of the element 28 result in being connected with the lands 18 on the base body 15.</p> |
