| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film by which embedding characteristic to super-microfabricated hole required for high integration of LIS or precise step coverage can be realized. SOLUTION: The method is used to manufacture a thin film containing metal atoms on a substrate through Plasma CVD method. In concrete, the thin film containing metal atoms is formed, while pulse vias voltage is being applied onto the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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