发明名称 CONDUCTIVE PATTERN SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive pattern substrate capable of precisely, easily, and inexpensively manufacturing the conductive pattern substrate, such as a multilayer board having a desired circuit pattern. <P>SOLUTION: An original plate 10A' is prepared in which a conductive layer 11 having a prescribed conductive pattern, and an insulating layer 12 are formed on a base material. Then, laser beams 25 are applied to the desired part of the conductive layer 11 from the side of the insulating layer 12 of the original plate 10A', thus melting a desired part of the conductive layer 11 and the corresponding part of the insulating layer 12 corresponding to the desired part, and forming a melted part 21a in a melted state for indicating electric conductivity at the corresponding part of the insulating layer 12. Then, a melted section 21 having electrical conductivity in a solidified state connected to the conductive layer 11 electrically is formed at an arbitrary location on the surface of the insulating layer 12, thus manufacturing a conductive pattern substrate 10A where a desired part of the conductive layer 11 can be connected to the outside electrically via the melted section 21 having electrical conductivity. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006269483(A) 申请公布日期 2006.10.05
申请号 JP20050081325 申请日期 2005.03.22
申请人 SHIBAURA MECHATRONICS CORP 发明人 KOYAMA HIROTAKA
分类号 H05K3/40;B23K26/00;B23K26/18;B23K101/42;H05K1/11;H05K3/46 主分类号 H05K3/40
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