TREATMENT OF SUBSTRATE SUB-SURFACE

摘要

Perforated structures and methods for forming perforated structures are disclosed. The perforated structures include partial holes or blind-holes that pass partially through the substrate. The partial holes can be positioned proximate to through-holes that pass entirely through the substrate. The partial holes add mechanical strength to the perforated substrate. Described are methods for modifying the optical appearance of the partial holes such that the partial holes appear indistinguishable from the through-holes, which allows for flexibility in designing cosmetically appealing patterns within the perforated structures.

主权项

1. A housing for an electronic device, the housing comprising:
a wall defining an internal cavity and having a perforated region at an exterior surface of the wall, the perforated region comprising:
a through-hole having a through-hole opening at the exterior surface, the through-hole connecting the through-hole opening to the internal cavity, anda blind-hole having a blind-hole opening at the exterior surface, the blind-hole formed partially through the wall and terminating at a terminal surface opposite the blind-hole opening, the terminal surface having a coating that absorbs light passing through the blind-hole opening and incident upon the coating.