发明名称 METHOD FOR MOLDING HOLLOW SPOILER
摘要 PURPOSE:To mold a hollow spoiler with a uniform wall thickness and a smooth surface by a method wherein a specific powder thermoplastic resin is put in a mold, the resin is melted and molded into a product shape while the mold is rotated and revolved in a heating furnace to reach a predetermined mold temperature, and the resin is cooled with the application of an air pressure to be molded into a product. CONSTITUTION:A powder thermoplastic resin having a particle size of 5-95 mesh is put in a mold. As the powder thermoplastic resin, polypropylene, modified polyphenylene, acrylonitrile butadiene styrene, polycarbonate, polyamide, polyacetal, and the like are used. The resin is melted and molded into a product shape while the mold is rotated and revolved respectively at 2-20rpm in a 150-450 deg.C heating furnace to reach a mold temperature of 100-400 deg.C. Thereafter, the resin is cooled with the application of an air pressure not lass than 0.5kg/cm<2> to a hollow part in the mold to be molded into a hollow spoiler.
申请公布号 JPH05269769(A) 申请公布日期 1993.10.19
申请号 JP19920066405 申请日期 1992.03.24
申请人 发明人
分类号 B29C41/06;B29C41/46;B29L22/00;B29L31/30;B62D37/02;(IPC1-7):B29C41/06 主分类号 B29C41/06
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