| 摘要 |
PURPOSE: To enable a CCD package to be lessened in weight, thickness, length, and size by a method, wherein the edge of a glass board is fixed onto the upsides of the tips of inner leads, the light-receiving region of the upside of a chip is covered with the glass plate, the edge of a light-shielding layer is fixed to the undersides of outer leads, and the underside of the chip is covered with the light-shielding layer. CONSTITUTION: Inner leads 22 are connected to a chip 27 through the intermediary of bonding bumps 31. After a conductor has been filled into a through-hole 35 bored in an insulator 34 provided to the outer surface of the inner lead 22, the outer leads 21 are connected to the inner leads 22 through the intermediary of the conductor filled in the through-holes 35. A light-shielding board 33 is provided under the chip 27 to shut off light rays which impinge on the chip 27 from below. At this point, the edge of the light-shielding board 33 is fixed to the outer base of the insulator 34, and the chip 27 and the light-shielding board 33 are fixed together with an adhesive agent layer 25. A glass plate 36 is mounted on the surface of the inner leads 22 above the chip 27. By this arrangement, the light-receiving region of the chip 27 is located adjacent to the glass plate 36. |
