| 摘要 |
<p>PROBLEM TO BE SOLVED: To develop an effective method for removing excess solder particles by loading the solder particles on a semiconductor substrate. SOLUTION: This method is for loading particles 12 and 16 on a substrate 14. Adhesive coating is applied to both surfaces of the substrate 14, and particles 12 and 16 are loaded on the adhesive area of the adhesive coating, and the all the particles 12 and 16 are loaded on each surface of the substrate 14. The particles 12 and 16 may be simultaneously reflowed afterwards. The particles may include various kinds of compositions, such as synthetic resin components including copper, other metals, alloys, or conductive plastics.</p> |
