| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer supporting device which can process or treat the entire surface of a wafer and also can stably rotatively support the wafer. SOLUTION: A plurality of support structures 2 which support an outer periphery of a wafer W having an identical substantial disk-shaped profile, respectively, are disposed away from each other. Each support structure 2 is structured by a pair of pulleys 3a, 3b disposed away from each other, and an endless belt 4 which is wound between the pulleys 3a and 3b by a tension and receives an outer periphery of the wafer W on an outer periphery side of a part located between the pair of pulleys 3a and 3b. A groove 6 which receives the outer periphery of the wafer W is formed along a peripheral direction on the entire outer periphery of the endless belt 4. |
