发明名称 SIMULTANEOUS GRINDING PROCESS FOR BOTH SURFACES OF WEPHERE
摘要 PURPOSE:To provide a superior wephere having less curve in an efficient manner by a method wherein a cup-shped wephere having curve is simultaneously ground at its both surfaces after the wephere is cut apart from ingot, and a convex surface of the wephere is ground by a grinder plate which rotates faster than the other grinder plate. CONSTITUTION:In the drawing is illustrated a condition in which a wephere 3 placed between both grinder plates 1 and 2 with a convex surface of the wephere having curve being faced upwardly is pressed until the curve is made to be flat, and a distribution of pressure produced at upper and lower grinder plates 1, 2 is also shown. In case that a relative speed of the plate 1 with respect to the wephere 3 is higher than that of the plate 2, the upper surface of the wephere 3 shows a higher pressure at its central part than at a circumference thereof, so that a much volume of grinding at the central part is found, and to the contrary a lower surface of the wephere 3 is applied with a higher pressure at its circumferential part than at its central part, so that a much volume of grinding is found at the circumferential part so as to reduce the curve. In this process, it is possible to provide a superior wephere having less curve in an efficient manner.
申请公布号 JPS5715667(A) 申请公布日期 1982.01.27
申请号 JP19800084759 申请日期 1980.06.23
申请人 发明人
分类号 B24B37/07;B24B37/10 主分类号 B24B37/07
代理机构 代理人
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