PACKAGE FOR INTEGRATED CIRCUIT

摘要

An integrated circuit package including a lead frame (11) sealed between base and cap portions (1 and 3) of the package enclosure. Outwards of the seal each lead (13) in the frame (11) follows an angled path so that manipulation of leads outside the package is unlikely to damage the seal. The angling of the leads (13) is effected by appropriately shaping the cap and base parts (1 and 3) of the package.