发明名称 THIN FILM MANUFACTURING EQUIPMENT
摘要 PURPOSE:To obtain thin film manufacturing equipment free from the occurrence of defects due to bumping from a sublimable material by providing an space heater which has a space covering the side faces and the top of a chimney-type evaporation source and also has an unopened opening on a line connecting the central cylinder of the evaporation source to a substrate to be coated with film. CONSTITUTION:The above thin film manufacturing equipment is equipped with a chimney-type evaporation source 1 to be charged with an evaporation material 7 and an electric power source 3 for heating the above. Further, a thermal shield cylinder 2 is provided and also a space heater 4 having a shape covering the side faces and the top of the evaporation source 1 is provided in order to allow the grains bumping from the evaporation source 1 in the direction of a substrate in the upper part to adhere to it. Although the above space heater 4 has an opening in the upper part, this opening is not opened on a line connecting the central cylinder of the evaporation source 1 to the substrate to be coated with film. Moreover, the space heater 4 is connected to an electric powder source 5 for heating independent of the evaporation source 1. Accordingly, a thin vapor-deposited film perfectly free from film defects due to bumping from SiO, Cd, Mn, etc., used for thin film formation by a sublimation method can be obtained.
申请公布号 JPH01152266(A) 申请公布日期 1989.06.14
申请号 JP19870311093 申请日期 1987.12.10
申请人 AGENCY OF IND SCIENCE & TECHNOL 发明人 KIZAKI SACHIKO;MORI HIROYUKI;TARUYA YOSHINOBU
分类号 C23C14/24 主分类号 C23C14/24
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