| 摘要 |
<p>A micromachined device (48) is packaged to reduce stiction. In one embodiment, a level of moisture is introduced in the package (60) to create a very thin film over surfaces of the device (48). The device (48) can also be packaged with a vapor deposition of an organic material (108) after a wafer of devices has been separated into individual dies and the individual dies are placed in open containers (112). In another embodiment, a micromachined device is positioned in an open package (120) and a liquid (126) or solid organic material is disposed within the package so that when the device is sealed, the organic material vaporizes and coats portions of the die to reduce stiction.</p> |
