首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
PACKAGING STRUCTURE OF PHOTODIODE
摘要
申请公布号
JPH11154757(A)
申请公布日期
1999.06.08
申请号
JP19970320659
申请日期
1997.11.21
申请人
ADVANTEST CORP
发明人
YOSHIDA HIROTAKA
分类号
H01L31/10;H01L31/02;(IPC1-7):H01L31/02
主分类号
H01L31/10
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Liquid sampling apparatus with gas trap
Float thread cutter
Improvements in multicontact relays
Spring seat construction
Improvements relating to resilient padding for laundry machinery
Improvements in and relating to lock washers or nuts
Improvements in or relating to mechanism for filling a mould or cavity with flowablepowdered solid material
Improvements in button-stemming machines
A process and an apparatus for separating a material into its various grain sizes
Filtre à air
Perfectionnements relatifs aux machines à répandre l'engrais
Colorants de la série anthraquinonique et leur procédé de préparation
Procédé pour l'oxydation catalytique de matières organiques en phase vapeur
échangeur de chaleur à tubes concentriques espacés
A method of rendering materials water-repellent
Improvements in and relating to rings for travellers in ring spinning machines
Improvements in or relating to the distribution of telephonic signals
Improvements in or relating to apparatus for dispensing fluids from a container under pressure
Improvements in or relating to anti-vibration mountings
Improvements in or relating to electric inductor constructions for use in high frequency electric induction heating
