发明名称 METHOD OF TREATING BASE MATERIAL WITH DISCHARGE PLASMA
摘要 PROBLEM TO BE SOLVED: To provide a method of treating a base material with a normal pressure plasma which can treat the large-area base material, can treat the base material uniformly and at high speed, and, moreover, does not exert damage on the base material. SOLUTION: In a method of treating a base material to be treated with a discharge plasma, a solid dielectric is installed on the opposing surface of an electrode on at least one side of electrodes opposing to each other under a pressure in the vicinity of atmospheric pressure, process gas is introduced between the electrodes, and the discharge plasma obtainable by applying a pulse-shaped electric field to the process gas is induced to the base material to be treated arranged outside a discharge space to bring the discharge plasma into contact with the base material to be treated. By adopting this method, the large-area base material can be easily treated, and, moreover, it becomes possible to lighten an electrical and thermal burden to the base material to be treated during the treatment.
申请公布号 JP2002237480(A) 申请公布日期 2002.08.23
申请号 JP20010200835 申请日期 2001.07.02
申请人 SEKISUI CHEM CO LTD 发明人 SHIMONISHI KOJI;YARA TAKUYA;YUASA MOTOKAZU
分类号 H05H1/26;B01J19/08;H01L21/205;H01L21/302;H01L21/304;H01L21/3065;H05H1/46 主分类号 H05H1/26
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