发明名称 PARTIAL SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To solve the problem that, when a plurality of electronic components nonresistive to heat (e.g. connectors having rows of parts to be soldered) are mounted in different row direction on a printed wiring board (plate-like work to be soldered) and then soldered by a partial soldering work, solder bridges are apt to appear. SOLUTION: An industrial robot 1 is provided for carrying a printed wiring board 3 selectably as desired with respect to its position and attitude on three- dimensional spatial coordinates. For partly soldering a plurality of connectors 75 different in row direction thereof with a jet wave 34 contacted to them, it is adjusted so that the array direction of each connector 75 is oblique, the printed wiring board 3 is carried at an elevation angle, and the width of the jet wave 34 is adjusted according to the width of the connector 75 in its carrying direction.
申请公布号 JP2002204064(A) 申请公布日期 2002.07.19
申请号 JP20000399953 申请日期 2000.12.28
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 TOBA HIDEAKI
分类号 B23K1/00;B23K1/08;B23K101/40;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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