ELECTROCONDUCTIVE PASTE, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

摘要

Provided is an electroconductive paste with which it is possible to control with high precision gaps between electrodes, and with which it is further possible to efficiently dispose solder particles on the electrodes, and to increase conduction reliability between electrodes. The electroconductive paste according to the present invention is used for connecting a first member to be connected having a first electrode on the surface thereof and a second member to be connected having a second electrode on the surface thereof, and electrically connecting the first electrode and the second electrode. The electroconductive paste includes a thermosetting component, a plurality of solder particles, and a plurality of spacers having a melting point of 250°C or higher, the average particle diameter of the spacers being greater than the average particle diameter of the solder particles.