| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electric device having high reliability of electrical continuity. SOLUTION: In the method for manufacturing the electric device 1, a flexible wiring plate 13 and a bond 12 are heated at a first heating temperature. Since a semiconductor chip 11 is positioned after a viscosity of the adhesive 12 is sufficiently lowered, air is not sucked in when the semiconductor chip 11 is placed on the adhesive 12. Since the adhesive 12 is heated at a second heating temperature higher than the first heating temperature and the viscosity of the adhesive 12 increases when an actual pressurized-bonding is carried out, residual voids are pushed out with a remaining adhesive together. Accordingly, there is not void in the adhesive 12 and the electric device having the high reliability of electrical continuity can be obtained. |
