Process for preparing a nonconductive substrate for electroplating

摘要

Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising the following steps: (a) preparing a liquid dispersion of carbon black comprised of: (1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion; (2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and (3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said nonconducting surfaces and is less than about 4% by weight of said liquid dispersion; (b) applying said liquid dispersion to the surface of the nonconducting material; (c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said nonconductive surface in a substantially continuous layer; and (d) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said nonconductive surface, wherein the improvement comprises adding an organic ionomer or polymer salt to the liquid dispersion in step (a).