发明名称 |
Method and system of laser processing |
摘要 |
A method for treating an object with a laser including emitting a laser beam from a laser; expanding the laser beam in a first direction; removing a portion of the laser beam though a mask, the portion including at least edges of the expanded laser beam extending in the first direction; and condensing the laser beam in a second direction orthogonal to the first direction in order to form a line-shaped laser beam on an object.
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申请公布号 |
US6149988(A) |
申请公布日期 |
2000.11.21 |
申请号 |
US19980208752 |
申请日期 |
1998.12.10 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
SHINOHARA, HISATO;SUGAWARA, AKIRA |
分类号 |
B23K26/06;B23K26/073;B41M5/24;H05K1/03;H05K3/02;H05K3/38;(IPC1-7):B05D3/06 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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