发明名称 Method and system of laser processing
摘要 A method for treating an object with a laser including emitting a laser beam from a laser; expanding the laser beam in a first direction; removing a portion of the laser beam though a mask, the portion including at least edges of the expanded laser beam extending in the first direction; and condensing the laser beam in a second direction orthogonal to the first direction in order to form a line-shaped laser beam on an object.
申请公布号 US6149988(A) 申请公布日期 2000.11.21
申请号 US19980208752 申请日期 1998.12.10
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 SHINOHARA, HISATO;SUGAWARA, AKIRA
分类号 B23K26/06;B23K26/073;B41M5/24;H05K1/03;H05K3/02;H05K3/38;(IPC1-7):B05D3/06 主分类号 B23K26/06
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