PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To improve connection reliability with another wiring board by inhibiting stress concentration in a conductor post formed on a wiring conductor of a printed wiring board.SOLUTION: A printed wiring board comprises: a wiring conductor layer 21 having a first face F1 and a second face F2; a conductor post 25 formed on a part of the second face F2 of the wiring conductor layer 21; and a resin insulation layer 30 which has a first surface SF1 and a second surface SF2, in which the wiring conductor layer 21 is embedded to expose the first face F1 on the first surface SF1 and which covers a lateral face of the conductor post 25. An end face 25a of the conductor post 25 on the side opposite to the wiring conductor layer 21 is exposed on the second surface SF2 side of the resin insulation layer 30. A lateral face 25c of the conductor post 25 is formed as a curved surface at an end of the conductor post 25 on the wiring conductor layer 21 side, so as to be curved outward further from the conductor post 25 with the decreasing distance from the wiring conductor layer 21.SELECTED DRAWING: Figure 1