| 摘要 |
PROBLEM TO BE SOLVED: To suppress reduction in bonding strength even when being used for a long period of time under a high temperature environment.SOLUTION: A bonding structure (100) includes: a bonding target object (110); a bonding target object (120); and a bonding layer (130). The bonding layer (130) bonds the bonding target object (110) and the bonding target object (120). The bonding layer (130) contains metal particles (132) and suppression particles (134), for suppressing crystal growth of the metal particles (132).SELECTED DRAWING: Figure 1 |
