发明名称 EPOXY RESIN COMPOSITION SUITABLE FOR LASER PRINTING
摘要 PURPOSE:To obtain an epoxy resin composition capable of applying clear printing to the resin surface by laser irradiation without lowering electric characteristics by blending a resin composition consisting of an epoxy resin, curing agent, filler, etc., with copper carbonate. CONSTITUTION:The objective epoxy resin composition obtained by blending (A) a resin composition containing an epoxy resin (e.g. bisphenol A type epoxy resin), curing agent, curing accelerator (e.g. imidazole compound), inorganic filler (e.g. crystalline silica powder), etc., with (B) copper carbonate, preferably having 100mum average grain size and content of the component B of 0.5-20wt.%. When the resin composition is irradiated in a form of character or pattern with laser, the resin surface is heated and the component B is decarboxylated at 300-400 deg.C, and converted into copper (II) oxide. Only the converted part is changed from pale blue to black, and as a result, characters or patterns can clearly be printed.
申请公布号 JPH0428756(A) 申请公布日期 1992.01.31
申请号 JP19900132645 申请日期 1990.05.24
申请人 SUMITOMO BAKELITE CO LTD;SUMITOMO DUREZ CO LTD 发明人 SASAI SHOJI
分类号 C08K3/26;B41M5/26;C08G59/00;C08L63/00;H01C1/04 主分类号 C08K3/26
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