| 摘要 |
The solder ball application method uses a screen (4) positioned in alignment with the ball grid array component (2), so that the contact pads of the latter correspond to holes (41) in the screen. The solder balls are positioned within the bores in the screen, before deposition on the surface of the ball grid array component, with removal of excess solder and heating of the ball grid array component, so that the solder balls are bonded to the corresponding contact pads, before removal of the screen.
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| 申请人 |
MARTIN GMBH, 82234 WESLING, DE |
发明人 |
MARTIN, BERNHARD, DIPL.-ING.(FH), 82234 WESLING, DE;PREUL, FRITZ, 82402 SEESHAUPT, DE;SCHALLY, THOMAS, DIPL.-ING. (FH), 82335 BERG, DE;WILD, ANDREAS, 82234 WESLING, DE |
