| 摘要 |
PROBLEM TO BE SOLVED: To directly fit elastic contact structure (430) to connection pads (310) on semiconductor dies (402a and 402b), before the semiconductor dies (402a and 402b) are made into single bodies (separated) from a semiconductor wafer. SOLUTION: A circuit board (710), having a plurality of terminals (712) arranged on the surface of the semiconductor die or an object similar to the board, is connected to the semiconductor dies (702 and 704). Thus, the semiconductor dies (402a and 402b) can be trained (tested and/or burnt in). The semiconductor dies (402a and 402b) are formed into the single bodies from the semiconductor wafer, and the same elastic contact structure (430) can be used for performing mutual connection between the semiconductor dies and the other electronic element (such as wiring boards and semiconductor packages). When the metal compound mutual interconnecting element (430) is used as the elastic contact structure, burn-in (792) is conducted at a temperature of 150 deg.C and it is completed in a time which is shorter than 60 minutes. |
