发明名称 Method of forming integrated stacked capacitors with rounded corners
摘要 Disclosed is an improved stacked capacitor with rounded corners for increasing capacitor breakdown voltage, and a method of constructing the same. The preferred method comprises rounding corners of a container-shaped bottom electrode. In particular, sharp corners of a pre-fabricated conductive silicon container are exposed to an ammonium hydroxide/peroxide mixture. The slow etching effect of the clean rounds angled surfaces thereby minimizing the high field effects usually associated with corners and other angled surfaces. Reducing such field effects by reducing or eliminating sharp corners helps prevent breakdown of the capacitor structure dielectric. When the conductive container includes a rough layer, such as hemispherical grained silicon, the invention provides the additional advantage of separating individual hemispherical grains, thus allowing later deposition of a uniformly thick dielectric layer.
申请公布号 US5985732(A) 申请公布日期 1999.11.16
申请号 US19970974204 申请日期 1997.11.19
申请人 MICRON TECHNOLOGY, INC. 发明人 FAZAN, PIERRE C.;FIGURA, THOMAS A.;SCHUEGRAF, KLAUS F.
分类号 H01L21/02;H01L21/306;H01L21/3205;H01L21/8242;H01L27/108;(IPC1-7):H01L21/70 主分类号 H01L21/02
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