| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin, preferably a polyimide resin suitably employable as a material for covering a circuit surface in electronic materials such as a cover-forming material for covering a substrate of a printed wiring board, particularly a polyimide resin that exhibits an excellent balance among properties (heat resistance, long-term environmental stability, insulating properties, solubility in organic solvents, flame retardancy and the like). SOLUTION: The polyimide resin has a recurring unit represented by general formula (1). The polyimide resin is employed as the cover-forming material for covering a conductor circuit pattern formed on a printed wiring board. COPYRIGHT: (C)2007,JPO&INPIT
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