| 发明名称 |
Electronics package and associated method |
| 摘要 |
An electronics package is provided. The electronics package may include an underfill layer having a surface that defines an opening. The electronics package may include a polymer bump structure disposed within the opening. A laminate for use as an underfill layer is provided. Associated methods are provided.
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| 申请公布号 |
US2007284758(A1) |
申请公布日期 |
2007.12.13 |
| 申请号 |
US20060438657 |
申请日期 |
2006.05.22 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
ZHANG JIAN;SIMONE DAVIDE L.;CARTER CHRISTOPHER M.;MEYER LAURA J.;BECKER CHARLES A.;SCHATTENMANN FLORIAN J.;TONAPI SANDEEP S.;RUBINSZTAJN SLAWOMIR;KEIMEL CHRISTOPHER F. |
| 分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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