| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inexpensive bonding apparatus which can be used at an experiment level. <P>SOLUTION: The bonding apparatus is provided with a stage 20 in which a first circuit component 100 is placed on an upper face and which can move in mutually orthogonal first direction and second direction, a jig 10 which sequentially positions an anisotropic conductive film 300 and a second circuit component 200 and places them on the first circuit component 100, a photographing part 30 enlarging them from above the stage 20 at the time of positioning and photographing them, a display part 50 displaying a picture which the photographing part 30 photographs, a pressurizing part 60 applying pressure to the circuit component 100 placed on the stage 20 and the second circuit component 200 placed across the anisotropic conductive film 300 in a direction for sandwiching the anisotropic conductive film 300, and a heating part 70 heating them when the pressurizing part 60 applies pressure. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
