| 发明名称 |
PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING |
| 摘要 |
A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer. |
| 申请公布号 |
US2016183362(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201514877359 |
申请日期 |
2015.10.07 |
| 申请人 |
International Business Machines Corporation ;King Abdulaziz City for Science and Technology |
发明人 |
Al-Saud Turki bin Saud bin Mohammed;Bedell Stephen W.;Fogel Keith E.;Lauro Paul A.;Sadana Devendra K. |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
a spalled material portion of a base substrate; a stressor layer located above said spalled material portion of said base substrate; and a handle substrate comprising a flexible material having: a radius of curvature of less than 30 cm and at least one metallization region, wherein said at least on metallization region is in contact with a surface of said stressor layer. |
| 地址 |
Armonk NY US |
