| 摘要 |
PROBLEM TO BE SOLVED: To provide an inverter device capable of reducing wiring inductance without increasing the physical size of the entire device.SOLUTION: In an inverter device 1, slits S1 and S2 extending along a first direction D1 is formed in conductor pattern P1 and P2 on a main circuit board 10, and a slit S3 extending along the first direction D1 is formed in a conductor pattern P4 on a capacitor substrate 70. For this reason, a current path CP1 on the main circuit board 10 and a current path CP2 on the capacitor substrate 70 are controlled by the slits S1 to S3 in a first direction and are parallel (and reverse directions) to each other. As a result, according to the inverter device 1, the wiring inductance as a whole can be reduced without increasing the physical size of the entire device by the mutual interaction between current change on the main circuit board 10 and the current change on the capacitor substrate 70 at the time of switching. |
