发明名称 SMALL-SIGNAL TRANSISTOR FOR SURFACE-MOUNTING USE
摘要 PURPOSE:To prevent a deformation and a disconnection of a bonding wire and to enhance reliability by a method wherein a resin is caused to flow along a longitudinal direction of the bonding wire and it is filled into a cavity seals the same. CONSTITUTION:Bonding wires 13a, 14a are arranged in such a way that their longitudinal direction is nearly parallel to side walls 21a, 22a of a cavity A; they are arranged nearly in a row; they are parallel also to an inflow direction 23a of a molten sealing resin flowing into the cavity. Accordingly, when the resin flows nearly perpendicularly into the cavity A via a gate opening part 17a from a wall face of an end wall 16a of the cavity A, a flow direction, inside the cavity, of the sealing region nearly coincides with a wiring direction of the bonding wires 13a, 14a. As a result, a resistance between the sealing resin and the bonding wires 13a, 14a during a sealing process is reduced sharply. Thereby, even when a thermoplastic resin is injected at high speed, the bonding wires 13a, 14a are not disconnected; reliability and yield are enhanced.
申请公布号 JPH02206155(A) 申请公布日期 1990.08.15
申请号 JP19890027164 申请日期 1989.02.06
申请人 TOSHIBA CORP;POLYPLASTICS CO 发明人 ADACHI MASAKI;SAKAI HIROMITSU
分类号 H01L21/60;H01L23/48 主分类号 H01L21/60
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