| 摘要 |
<p>PURPOSE:To provide a manufacturing method for a semiconductor-device storing package, in which a metallized pad on an insulating board is firmly joined to a given outer terminal with no fear of a defective short circuit between the metallized pads. CONSTITUTION:A plurality of metallized pads 7 are formed in an enclosed line on a surface of an insulating container so that the end of the pads 7 are projected by turns on the inward or outward sides. The outward projected metallized pads 7a are joined in common at their projected regions with a first belt-shaped solder material 11a, while the inward projected metallized pads 7b are joined in common at their projected regions with a second belt- shaped solder material 11b. Then, an tip part of an outer lead terminal 8 is mounted on each metallized pad 7 and the first and second belt-shaped solder materials 11a and 11b are melted by heat so that the outer lead terminal 8 is joined to each metallized pad 7.</p> |
