| 摘要 |
PURPOSE:To easily detect an unconnected part due to the connection defect of power-supply pads on the side of a chip and on the side of a mounting board and to prevent that the trouble of a discontinuity due to an electromigration or the like by an overcurrent in order to supplement an electric current from an unconnected power-supply pad is caused in a semiconductor integrated circuit by a flip-chip mounting system. CONSTITUTION:A chip 1-1 is divided into a plurality of areas 1-2, a power supply pad 1-5 which supplies an electric current required for a circuit operation inside each area 1-2 is installed in every area 1-2 so as to be only one per individual power-supply buses 1-3, 1-4, and the respective power-supply buses 103, 1-4 are constituted so as not to be connected between the individual areas 1-2. Thereby, when the chip 1-1 is mounted on a mounting board and even when power-supply pads 1--5, 106 are not connected, the defect of an unconnected part can be detected because a circuit to which an electric current is to be supplied is not operated due to an unconnected power-supply pad when an electrical functional test is conducted. |
