SEMICONDUCTOR DEVICE AND ITS FABRICATION

摘要

PURPOSE: To provide an inexpensive semiconductor device in which the fabrication is facilitated by simplifying the structure. CONSTITUTION: An interconnection pattern 40, connected with the electrode 36 of a semiconductor chip 32, is formed on the surface of a first insulation film 38 deposited on a passivation film 34 of the semiconductor chip 32. A second insulation film 42 is deposited on the interconnection pattern 40 while exposing the joint to the outer connection terminal and an outer connection terminal 46 is formed at the exposing joint to the outer connection terminal of the interconnection pattern 40.